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Direct-to-Chip Cooling for Data Centers

Direct liquid cooling technology for your data center.

Direct to Chip Liquid Cooling for CPUs and GPUs

Trends such as AI computing have dramatically increased the amount of electricity needed in data centers, with this organizations are seeking to balance the benefits of AI with sustainability concerns.

Many are turning to direct-to-chip cooling — an advanced data center liquid cooling method that applies coolant directly to the server components that generate the most heat including CPUs and GPUs.

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Data Center Challenges

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    Data Center Space
    • More computing power requires more hardware. Many IT teams are are finding that they are running out of space in their data centers.
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    Energy Costs
    • The financial strain of operating and cooling data center gear. Additionally, some operators have reached the energy limit of what the grid can provide.
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    Emphasis on Sustainability
    • With growing importance on sustainability and benchmarks, IT teams need to use less energy and water, not more.
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How Direct to Chip Cooling can Help

Direct to chip cooling companies empower data center teams to do more with less. Less space. Less energy. Less cost.
  • 50–1000x more efficient than air cooling reducing energy consumption 25–30%.
  • Reduced energy consumption translates to a smaller carbon footprint, contributing to sustainability goals.
  • More efficient cooling allows for higher server densities in racks.

Key Benefits of Direct Liquid Cooling with Park Place

Improved Energy Efficiency/Lower Operational Costs 50–1000x more efficient than air cooling reducing energy consumption 25–30%, significant reduction in need for air conditioning
Minimized Environmental Impact Reduced energy consumption translates to a smaller carbon footprint contributing to sustainability goals
Support for High TDP (Thermal Design Power) CPUs and GPUs into thousands of watts per chip vs. 200–300x ceiling with air cooling
Increased Computing Density More efficient cooling allows for higher server densities in racks
Enhanced Performance and Reliability Components can operate at higher clock speeds without overheating, possibly extending their lifespan/reducing the frequency of replacements
Scalability Can be scaled to meet the demands of high-performance computing environments
Simple Installation Can be quickly applied to a singe server or an entire cabinet, with or without facility water

A Comprehensive Direct to Chip Cooling Solution

Park Place Technologies can serve as a single-vendor solution for your direct liquid cooling applications. This includes:

  • Procurement and installation of hardware for the direct to chip liquid cooling process.
  • Maintenance of server and direct to chip cold plate.
  • Ongoing performance and sustainability monitoring.

Park Place Technologies removes the complexities of the direct-to-chip liquid cooling journey – we serve as a single-vendor solution for the entire process.

Searching for an alternative liquid cooling solution? Look at our immersion cooling option.

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